Research and application of reliability of high thermal conductivity nano-silver adhesive
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Graphical Abstract
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Abstract
The reliability study and application of nano-silver adhesives with high thermal conductivity have attracted widespread attention. The recent research on nano-silver adhesive was reviewed, and its preparation, reliability and application were introduced. In addition, the research limitations and future development direction of nano-silver adhesive were summarized, so as to provide some theoretical references for the practical application of nano-silver adhesive with high thermal conductivity.
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